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  1. CLR 1190 / CLH 6140

    General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

  2. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  3. CLR 1205 / CLH 6770

    Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

  4. CLR 1370 / CLH 6560

    General purpose, shock resistant, Room temperature Cure. Excellent Tensile. An adhesive with excellent tensile shear and good peel strength after a 24 hour room temperature cure. Product exhibits excellent shock resistance in potting applications. CLR 1370 / CLH 6560

  5. CLR 1376 / CLH 6930

    130°C Operating. Low Exotherm, low shrinkage, excellent shock resistance. A two component epoxy which is recommended for potting and casting transformers, coils and other electronic components. The system provides a good pot life with low exotherm and shrinkage. Cured material has excellent thermal shock resistance. CLR 1376 / CLH 6930

  6. CLR 1396 / CLH 6930

    Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

  7. CLR 1415 / CLH 6220

    Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

  8. CLR 1476 / CLH 6730

    Low viscosity epoxy, Suitable for machine dispense, Pot / Cast electronic switches. A low viscosity, general purpose, room temperature curing, epoxy encapsulant. Product is filled with non-abrasive fillers suitable for machine dispensing. Product has good physical, thermal and electrical properties. CLR 1476 / CLH 6730

  9. CLR 1510 / CLH 6580

    Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580

  10. CLR 1556 / CLH 6510

    Good thermal cycling, 2:1 mix by volume. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6510

  11. CLR 1556 / CLH 6520

    Soft 50/40D, Slow gel - Electronic Modules, Machinable. A low viscosity, flexible, room temperature cure, potting compound. The material has a long pot life and good thermal cycling endurance. CLR 1556 / CLH 6520

  12. CLR 1556 / CLH 6640

    Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640

  13. CLR 1566 / CLH 6020

    Excellent heat dissipation, 125°C Operating. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6020

  14. CLR 1566 / CLH 6025

    Long pot life, Excellent heat dissipation. A thermally conductive two part epoxy system. The system was specifically designed for applications where heat dissipation on thermally sensitive devices is required. CLR 1566 / CLH 6025

  15. CLR 1583 / CLH 6229

    Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229

  16. CLR 1710 / CLH 6710

    Abrasion Resistant Epoxy. An abrasion resistant, two component epoxy surface coat. CLR 1710 / CLH 6710

  17. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  18. CLR 1820 / CLH 6440

    Product is machine dispense friendly. A filled, high temperature operating, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive fillers and convenient mix ratio makes it suitable for processing in automatic dispense equipment. As part of an insulating system, it will meet class H, electrical temperature. This product meets UL94-V1 in house flammability testing. CLR 1820 / CLH 6440

  19. CLR 1821 / CLH 6441

    UL 94-V1 Epoxy system for casting and potting electrical and electronic components, as part of an electrical insulating system it will meet Class H electrical temperature classification. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. CLR 1821 / CLH 6441

  20. CLR 1826 / CLH 6445

    1:1 Mix Ratio, Fast Gel, Medium viscosity, Flameout, 180°C operating, Ballast potting. A filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio make it suitable for processing in automatic dispense equipment. This product meets UL94-V1 in house flammability testing. CLR 1826 / CLH 6445

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